Mass Electronics Invest in new Manufacturing Equipment

Mass Electronics (Brisbane) took delivery of the next generation of SURFACE MOUNT “Pick & Place” machines in late May.

The machines were unpacked, positioned within the surface mount department alongside the existing surface mount line and services provided in readiness for the commissioning and operator training scheduled for 6^th June

Technical support from both Hanwah (South Korea) and Machinery Forum (Australia) supported by Mass Electronics Research and Development (RND) and Production Operations team in commissioning / operator training week commencing 6^th June.

Mass Electronics has made a significant investment in this equipment to support ongoing growth, improve throughput and minimise waste due to component dropping by utilising the high reliability Nozzle checking system and many other technological advancements.

The Nozzle checking system utilises a flying camera to check nozzles before and after placement to prevent the placement of missing / wrong components.

High productivity being achieved through optimizing PCB transportation paths using modular conveyors.

The DECAN F2 next-generation high-speed universal chip mounter, provides the highest productivity and mounting precision in its class.

The modular conveyor allows Optimal PCB flow and it is possible to convert to large board handling in the customer facility. Stage vision and tray feeder options increase its flexibility.

High-precision, convenient electric feeders

• Calibration and maintenance-free.

• Convenient operation with single reel bank mounted feeder

• Improved productivity through automatic part pick-up position alignment

Reduced work load through automated

components loading smart feeder

• Industry first automatic loading and splicing capabilities

• Significantly reduces setup and changeover times

• Zero consumables costs for splicing